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HI3D PVD - CVD - TD Comparison
Chemical Vapor
Deposition (CVD, 'hot process') and Thermal Diffusion (TD) advantages:
good to excellent adesion. TD considered
best process available for heavy duty stamping and punching applications
uniform thickness, even in deep holes and
recesses
CVD equipment can handle large and TD medium
size parts
CVD and TD
disadvantages:
high temperature of the process - approx.
1000C (1832F)
significant demensional changes and
geometrical distortions
decarburization of the part top layer,
resulting in deep damage to the surface when the coating finally fails
loss of part's hardness
weakening of carbides binder
Physical Vapor
Deposition (PVD, 'cold process') advantages:
lower process temperature - approx. 500C
(932F)
lower dimensional changes and geometrical
distortions
reduced surface decarburization
PVD disadvantages:
low to medium adhesion. Performance
acceptable for light duty stamping operations only
non-uniform thickness. Low penetration in
deep holes and recesses
equipment capabilities limit process to
small and medium parts
Sputtek's High
Ionization Deep Diffusion Deposition (HI3D) advantages:
lowest process temperatures of 250-450C
(482-842F), depending on the coating applied
high density and adhesion coatings, with
life 200 - 500% higher than CVD and 10 - 50%than TD in heavy duty stamping and punching
operations - proven on presses up to 4,000T processing hot rolled steel with highly
abrasive surface, or on thickness up to 9.5mm (.375in.) in small diameter
deep draw
configurations
tight tolerance dimensional and geometrical
changes, acceptable for high precision parts
no decarburization of the surface,
maximizing tool fatigue life and avoiding surface damage at failure -
even precision tools can be restored by stripping, light polishing and recoating
improved thickness uniformity and depth
penetration in comparison with traditional PVD capabilities
parts up to 750x750x500 mm
(30x30x20in) or 450 kg (1000 lb) can be coated in 3-4 days. Larger
dimensions and weights can be handled in the near future.
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